Numerical simulation of the optical characteristics of LEDs and LED modules
In this research area, the optical characteristics of LED devices are calculated. The design of LED devices is being optimized to reduce optical power losses and improve color characteristics. Various designs of LED devices are considered: chip-on-board LED modules, packaged LEDs, RGB LEDs, LEDs with a remote phosphor. One of the modern implementations of light emitting diode technology is a so-called ‘‘chip-on-board’’ (COB) module. COB represents an array of light-emitting chips placed on a common substrate, which are electrically connected to the metal plating and covered by encapsulating material. COB demonstrates a number of advantages over an array of individual LEDs assembled into a lighting element. These advantages are the following: • reduction of manufacturing cost due to the use of shared electrical connections and optics; • bigger optical power; • more compact size. Another approach to improving LED performance is remote phosphor technology. In this method the phosphor is separated from the LED itself and utilized in a remote substrate or plate. White light materializes when blue LED light passes through the remote phosphor, creating one visible light source, the phosphor itself, rather than several glaring diodes. This new advanced technology creates glare reduction, less color shift, increases efficiency, reduced heat, and lifecycle enhancement.
